The main service of Division I is for marketing LED and Semi Conductor's Encapsulate, Molding Compound, Print Circuited Board Ink, etc. from Europe, USA and Japan. We provide the total solution for our clients.

Due to the development of Taiwan Electronics Industry and our loyal clients' supports, our sales have been growing steady. We are now the leading professional sales and service in this field.

In order to provide effective services to domestic and international customers, we have established braches in Shanghai, Guangzhou, Tianjin and Fuzhou in China. And our headquarter is in Taipei Taiwan.

We, as Division I, appreciate our team and loyal customers whom make us keep going forward. Our goal is to continue to provide the highest quality products and best services to our customers.

■ Hysol Chip-On-Board Glob Tops
 
　Hysol Chip-On-Board Glob Tops  

brand type description purpose characteristic
Hysol EO-1062 One component, Black Glob top for COB applications high reliability, high glob-height, low CTE
  EO-1016 One component, Black, unique COB encapsulant COB applications, Liquid Encapsulant for transistors、similar semiconductors、watch IC'S UL94V-O,excellent shelf stability,flame-out and fast curing, medium hemispheroidal height, The cured material survives severe thermal shock,Uncured material easy to absorb moisture.
  EO-1080 One component, Black COB applications, encapsulate transistors、 similar semiconductors and watch IC'S add silica EO-1016, low CTE, low cost. The cured material survives severe thermal shock.
  EO-1061 One component, Black, COB encapsulant COB applications high reliability, low CTE, Uncured material more easy to absorb moisture than EO-1016, medium hemispheroidal height, low CTE, Non-Thixotropic Liquid, pass 1000hrs of temperature/humidity/bias testing and thermal cycling up to 125℃.
  EO-1081 One component, Black, COB encapsulant COB applications medium glob-height, medium fluidity,well stability under 25℃.
  EO-1072 One component high performance epoxy encapsulantt Casting compounds specially for Smart Card low ionics content, high TG, Unique rheology : as a flow control at 85~100℃, as a fill encapsulant at 45~60℃.
  EO-1060 One component, Black COB applications lower ionics content and CTE than EO-1016, high flow, low viscosity,add calcium carbonate fit to burnish after cured.
  EO-1057 One component epoxy encapsulant Casting Compound a modified version Hysol EO1016, UL-94-V-0
  EO-1088 One component COB encapsulant particularly suited for use on transistors、similar semiconductors and watch IC's. suited for lead-free reflow
 
　Hysol Underfills　  

Package Level Underfills
brand type description purpose characteristic
Hysol FP4548FC One component Gray Flip Chip Lead-free flip chip packages(L3/260℃);low-k/Cu flip chip package with hi-phbumps.
  FP4549SI One component white Flip Chip Fast-flowing, low stress underfill for fine-pitch flip chip applications.

Board Level CSP/BGA and Flip Chip Underfills
brand type description purpose characteristic
Hysol 3593 One component Black Underfills Fast-flowing, Snap cure
  FP6101 One component Black Removable CSP or BGA underfill Fast-flowing, Snap cure
  FP4530 One component Black Flip Chip Underfill Fast-flowing, Snap cure
  FP4531 One component Black Flip Chip Underfill Fast-flowing, Snap cure
  FP4532 One component Black Flip Chip Device Fast-flowing, Snap cure
 
　Hysol Encapsulants　  

Flow Controll/Dam Materials
brand type description purpose characteristic
Hysol FP4451 One component Black BGAs， Flow Control Dam Industry Standard damming material for BGAs
  FP4451TD One component Black Dam Meterials Tall Dam of FP4451
  FP6401 One component Black Flow control barrier around areas of bare chip encapsulation Zero stress dam for ceramic or large array packages

Fill Encapsulants
brand type description purpose characteristic
Hysol CB0260 One component Black BGA CSPs(chip scales packages) PBGA High performance encapsulant。JEDEC LEVEL 2A
  CB064 One component Black Fill Encapsulants Low CTE & Low stress version of FP4450
  FP4450 One component Black BGAs，Fill Encapsulants Industry Standard fill material for dam and fill or cavity down BGAs
  FP4450HF One component Black Semiconductor encapsulant High flow version of FP4450LV
  FP4460 One component Black Glob Top Glob top version of FP4450
  FP4470 One component Black Encapsulant for use in applications utiliz ing lead free solder High adhesion version of FP4450 for 260℃ L3 JEDEC performance
  FP4651 One component Black Cavity-fill and fine wire pitch applications very low stress
  FP4652 One component Black Cavity-fill and dam and fill applications Fast cure，low stress version of FP4450 for large array packages
 
　Hysol Circuit Board Protection  

Potting/Encapsulation Epoxy - Room-Temperature-Cure
brand type description purpose characteristic
Hysol ES-0620 Two component,
Unfilled clear epoxy		   Clear,fast gelling epoxy resin with excellent wetting and good
chemical resistance.
  ES-4212 Two component, black Potting, Coil, Sensors, Filter, Inductor,
Transformer power supply		 Versatile,black potting system.Features long pot life.easy mix ratio,
soft filler.Machine dispensing or hand mixing.
  ES-4412 Two component, black Potting, Coil, Sensors, Filter, Inductor,
Transformer power supply		 X-ray opaque potting system.Low viscosity, long pot life, easy mix ratio
  ES-4512 Two component, black Potting, Coil, Sensors, Filter, Inductor,
Transformer power supply		 UL 94V-0 recognized potting compound with convenient one-to-one mix ratio
  ES-6005 Two component, black Potting, Coil, Sensors, Filter, Inductor,
Transformer power supply		 Fast gelling, flame retardant,black potting compound.Easy mix ratio, low viscosity,
room-temperature-cure,ideal for potting/encapsulanting high volume parts.
UL 1446 recognized and UL94 HB flame retardant.

Conformal Coatings
brand type description purpose characteristic
Hysol PC12-0007M Two component Insulate, water-proof, dust-proof Epoxy，Medium viscosity, 100% solids epoxy coating, shock resistant.
Application: dip or brush
  PC17M Two component Insulate, water-proof, dust-proof Epoxy，Low viscosity.Long work life, excellent undercoat for electronic devices
prior to encapsulation. Application: Dip brush or spray
  PC18M One component Insulate, water-proof, dust-proof Urethane，moisture cure, long work life, 7 day RT cure. Low out-gassing(NASA)
  PC29M One component Insulate, water-proof, dust-proof Urethane，Superior moisture resistance, excellent flexibility & retention of electrical properties.
  PC20M One component Insulate, water-proof, dust-proof Easily removable, rapid tack-free time. High viscosity and high solids content.
Good moisture sealant.
  PC20M-35M One component Insulate, water-proof, dust-proof 35% soilds version of PC20M. Medium viscosity, solvent removable.
 
Hysol Semiconductor Molding Compounds  

brand type description purpose characteristic
Hysol MG15F molding compound Power Discrete, High Voltage Rectifier Power Discrete,RF and High Voltage Rectifier. Designed for high voltage power applications requiring good electrical stability at high temperature.
  MG35F molding compound Low voltage diodes, small signal transistors Designed for low voltage diodes, small signal transistors and certain outline transistors.
  MG46F molding compound Power Discrete, High Voltage Rectifier designed for encapsulation of TO,PDIP &SOIC packages. Applicable for devices having chip dimensions up to 250 mils square