The main service of Division I is for marketing LED and Semi Conductor's Encapsulate, Molding Compound, Print Circuited Board Ink, etc. from Europe, USA and Japan. We provide the total solution for our clients.

Due to the development of Taiwan Electronics Industry and our loyal clients' supports, our sales have been growing steady. We are now the leading professional sales and service in this field.

In order to provide effective services to domestic and international customers, we have established braches in Shanghai, Guangzhou, Tianjin and Fuzhou in China. And our headquarter is in Taipei Taiwan.

We, as Division I, appreciate our team and loyal customers whom make us keep going forward. Our goal is to continue to provide the highest quality products and best services to our customers.

■LED Light Emitting Diode
 
 Liquid encapsulants  

Brand Type Description Purpose Characteristic
IK HL8800 A/B part ,clear for traditional lamp、High bright product: outdoor screen/Flux-fill type LED high performance, excellent reliability / CHMSL
  HL8800-850 A/B part ,black for IRDA(750nm、850nm) already add black color dye for cutting visible light
  HL2002 A/B part ,clear for Top View LED/SMD LED good adhesion to PPA,excellent reliability,for blue、white chip
  HL1601 A/B part ,clear for Top View LED/SMD LED low stress, for blue、white chip
  IK0001 A/B part ,clear low stress, for traffic light, tradtional lamp low stress、flexibility same as Hysol HL3100-3,
  IK0002 A/B part ,clear for display low stress, same as Hysol HL4210
  ST-1L A/B part ,clear for lamp not yellowing, high TG, for automobile and outdoor display
 
 Mold compound   

Brand Type Description Purpose Characteristic
HYSOL MG18 series epoxy molding compound for the encapsulation of Lead-Frame several special colors are available, liquid type (B-stag)
  OP1000 clear epoxy molding compound for the encapsulation of Lead-Frame、SMD LED power typed. Low moisture absorption,not yellowing,for white、blue chip and super bright. Could pass Red-Ink Test
  OP1030 clear epoxy molding compound suitable for IRDA & IRM Product power typed. High performance, high reliability test
  OP8000 clear epoxy molding compound for the encapsulation of Lead-Frame、SMD LED power typed. contain internal release
 
 other products   

Brand Type Description Purpose Characteristic
IK AC4368E Silicon Oil super mold release agent, higher quality releasability, pail and spray can are available
  A6003   diffuser component is Silica
  AI3511   blue dye  
Hysol MCL100 melamine cleaning compound for cleaning molds higher quality releasability
  MCL-200C melamine cleaning compound for cleaning molds higher quality releasability,in square preforms