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The main service of Division I is for marketing LED and Semi Conductor's
Encapsulate, Molding Compound, Print Circuited Board Ink, etc. from
Europe, USA and Japan. We provide the total solution for our clients.
Due to the development of Taiwan Electronics Industry and our loyal
clients' supports, our sales have been growing steady. We are now
the leading professional sales and service in this field.
In order to provide effective services to domestic and international
customers, we have established braches in Shanghai, Guangzhou, Tianjin
and Fuzhou in China. And our headquarter is in Taipei Taiwan.
We, as Division I, appreciate our team and loyal customers whom
make us keep going forward. Our goal is to continue to provide the
highest quality products and best services to our customers.
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■LED Light Emitting Diode |
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Liquid encapsulants |
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Brand |
Type |
Description |
Purpose |
Characteristic |
IK |
HL8800 |
A/B part ,clear |
for traditional lamp、High bright product: outdoor screen/Flux-fill type LED |
high performance, excellent reliability / CHMSL |
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HL8800-850 |
A/B part ,black |
for IRDA(750nm、850nm) |
already add black color dye for cutting visible light |
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HL2002 |
A/B part ,clear |
for Top View LED/SMD LED |
good adhesion to PPA,excellent reliability,for blue、white chip |
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HL1601 |
A/B part ,clear |
for Top View LED/SMD LED |
low stress, for blue、white chip |
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IK0001 |
A/B part ,clear |
low stress, for traffic light, tradtional lamp |
low stress、flexibility same as Hysol HL3100-3, |
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IK0002 |
A/B part ,clear |
for display |
low stress, same as Hysol HL4210 |
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ST-1L |
A/B part ,clear |
for lamp |
not yellowing, high TG, for automobile and outdoor display |
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Brand |
Type |
Description |
Purpose |
Characteristic |
HYSOL |
MG18 series |
epoxy molding compound |
for the encapsulation of Lead-Frame |
several special colors are available, liquid type (B-stag) |
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OP1000 |
clear epoxy molding compound |
for the encapsulation of Lead-Frame、SMD LED |
power typed. Low moisture absorption,not yellowing,for white、blue chip and super bright. Could pass Red-Ink Test |
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OP1030 |
clear epoxy molding compound |
suitable for IRDA & IRM Product |
power typed. High performance, high reliability test |
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OP8000 |
clear epoxy molding compound |
for the encapsulation of Lead-Frame、SMD LED |
power typed. contain internal release |
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Brand |
Type |
Description |
Purpose |
Characteristic |
IK |
AC4368E |
Silicon Oil |
super mold release agent, |
higher quality releasability, pail and spray can are available |
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A6003 |
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diffuser |
component is Silica |
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AI3511 |
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blue dye |
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Hysol |
MCL100 |
melamine cleaning compound |
for cleaning molds |
higher quality releasability |
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MCL-200C |
melamine cleaning compound |
for cleaning molds |
higher quality releasability,in square preforms |
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